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TECH 기술분야
Glass Attach
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장비 능력
| Glass thickness | 20um |
|---|---|
| Glass handling size | 1.02 x 1.02mm(min), 50 x 50mm(Max) |
| Glass placement | +/- 15um @ 3σ (Auto Inspection & align system) |
| Glass theta rotation | +/- 0.15° @ 3σ (Auto Inspection & align system) |
| Glass wafer size | 8” and 12” |
| Package handled | LCC, Leadframe, BGA, CSBGA, Stacked CSP,, |
| Disepense handled | Pattern, Glop top(COB), Potting, Under-fill, Molding,, |