기술분야
Min/ Max Die Size | 0.87~25mm |
---|---|
Thin die Capability | 75㎛ |
Accuracy for XY and Theta | XY : ±25㎛ Theta : 0.5 |
Camera Magnification Pre Bond/Bond Post Bon |
Pre Bond : 0.23~0.46 Option Bond Post bond : 0.15~0.87 Zoom |
Wafer Size | 8inch ~ 12inch |
Bond Force (Standard) | 15N |