주메뉴
-
Company
Company overview Greetings from CEO Management policy Quality policy Environmental policy Conflict Minerals Certifications Organization History Location
-
Business
-
Technology
Manufacturing
environment Assembly Visual Test Reliability Test -
R&D
Current patent status Electrical device Package Development Road map
-
Recruit
Personnel system Recruit announcement Right people Welfare FAQ on recruitment
-
Support
TECHNOLOGY
TECHNOLOGY
Saw
> Tachnology > Assembly > Saw
Equipment ability
| Wafer Size | 8inch ~ 12inch |
|---|---|
| High output Spindel | 2.2kw |
| Blade Distance | Min 21mm |
| Cut Method | work proper for the Dual Cutting, Single Cutting, Step Cutting |
| Co2 Gas | Available |