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TECHNOLOGY
TECHNOLOGY 技术领域
Wire Bonding
> 技术领域 > Assembly > Wire Bonding
设备能力
| Bonding Area | X Axis : 56mm / Y Axis : 80mm |
|---|---|
| Placement Accuracy | ± 2.0 um |
| Wire Sway | Wire Length < 2.54mm : 25um @ 3 sigma |
| Ultral Fine Pitch | 35um in-line @ 3 sigma |
| Die Pad Down Set | UP To 2.3 mm |