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Ceramic Leadless Chip Carrier
基板的形态是用陶瓷制作，具有高信赖性及容易排热的结构，陶瓷的Bottom面上有连接芯片和Wire Bonding的Lead和连接模块基板和SMT的BGA或是Land.图像传感器的特性上，为了防止异物，玻璃防护罩安装在陶瓷机身上来保护传感器。
| Device | Size | Thickness | Lead | Substrate |
|---|---|---|---|---|
| 40CLCC | 10.16mm SQ | 1.60mm | 40Leads | Ceramic |
| 64CLCC | 11mm SQ | 1.60mm | 64Leads | Ceramic |
| 64CLCC | 11.1mm SQ | 1.60mm | 64Leads | Ceramic |
| 60CLCC | 12mm SQ | 1.60mm | 60Leads | Ceramic |
| 48CLCC | 14.22mm SQ | 1.60mm | 48Leads | Ceramic |
| 225CLGA | 25x22.5mm | 1.60mm | 225LGA | Ceramic |
| 139BGA | 36x25mm | 1.60mm | 139BGA | Ceramic |